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Application of Bioinspired Structural Ceramics with High-Temperature Electrical Insulation and High Adhesion in
Zhenyin Hai1, Yue Chen1, Zhixuan Su1
1School of Aerospace Engineering, Xiamen University, Xiamen 361005, China.
Abstract:
Surface erosion of the coaxial thermocouple probe initiates continuous bridging of thermoelectric materials on the insulation layer surface, forming new temperature measurement junctions. This inherent ability to measure continuous self-erosion ensures the operational reliability of the coaxial thermocouples in high-temperature ablative environments. However, the fabrication of a high-temperature electrical insulation layer and a high-adhesion insulating layer in the coaxial thermocouples remains a challenge. Inspired by calcium carbonate/oxalate crystals in jujube leaves that strengthen the leaves, a bioinspired structural ceramic (BSC) mimicking these needle-like crystals is designed. This BSC demonstrates excellent high-temperature insulation (with insulation impedance of 2.55 kΩ at 1210 °C) and adhesion strength (35.3 Newtons). The BSC is successfully used as the insulating layer in a K-type coaxial thermocouple. The generation rules for surface junctions are systematically studied, revealing that stable and reliable measurement junctions can be created when the sandpaper grit does not exceed 600#. Static test results show that the K-type coaxial thermocouple ranges from 200 °C to 1200 °C with an accuracy of 1.1%, a drift rate better than 0.0137%/h, and hysteresis better than 0.81%. Dynamic test results show that the response time is 1.08 ms. The K-type coaxial thermocouple can withstand a high-temperature flame impact for 300 s at 1200 °C, as well as over forty cycles of high-power laser thermal shock, while maintaining good response characteristics. Therefore, the K-type coaxial thermocouple designed in this study provides an ideal solution for long-term temperature monitoring of the thermal components of aerospace engines under extremely high-temperature, high-speed, and strong thermal shock conditions.
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