Controllable Preparation of Oriented Boron Nitride Nanosheets/Polyacrylate Pressure-Sensitive Adhesive Composites...

Traditional approaches to constructing thermally conductive networks typically necessitate costly equipment and intricate processes, rendering them unsuitable for mass production and commercialization. Here, we propose a facile strategy to construct highly oriented boron nitride/polyacrylate pressure-sensitive adhesive frameworks by a calendering process. A UV light-based bulk polymerization method is adopted to prepare the pressure-sensitive adhesives (PSAs), which makes the preparation process solvent-free and volatile organic compound (VOC)-free, and environmentally friendly compared to emulsion and solvent-based pressure-sensitive adhesives. This simple, economical and scalable method provides new ideas and ways for the preparation of advanced thermal conductive networks. The highly oriented and flexible m-BNNSs/polyacrylate pressure-sensitive adhesive composites (m-BNNSs/PSAs-Ori) exhibited a significantly high thermal conductivity (TC) of 0.9552 W/(m·K) at 25 wt% filler content. Significantly, m-BNNSs/PSAs-Ori composites showed a better thermal response than the single-layer thermally conductive pressure-sensitive adhesive. Moreover, the composites also possess excellent electrical insulation and mechanical properties. This exploration not only provides a reasonable design scheme for thermal interface materials, but also promotes the practical application of polyacrylate pressure-sensitive adhesive composites in thermal management.