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Published on: April 12, 2018
A CMOS-integrable ambipolar tellurene nanofilm-based negative differential transconductance transistor for
Jihoon Huh1,2, Yuna Kim1, Bolim You1,2
1Department of Materials Science and Engineering, Inha University, 100 Inha-ro, Michuhol-gu, Incheon 22212, Republic of Korea. mghahm@inha.ac.kr.
Researchers developed a novel tellurium (Te) nanofilm transistor compatible with complementary metal oxide semiconductor (CMOS) technology. This device exhibits negative differential transconductance (NDT) for advanced multi-valued logic computing without complex fabrication.
Area of Science:
- Materials Science
- Nanotechnology
- Electronics Engineering
Background:
- Development of nanomaterial-based ternary inverters is often limited by complex fabrication processes, hindering scalability and integration.
- Existing approaches struggle to achieve multi-valued logic computing efficiently and with simplified manufacturing.
Purpose of the Study:
- To present a complementary metal oxide semiconductor (CMOS)-compatible ambipolar tellurium (Te) nanofilm transistor.
- To demonstrate the potential of this transistor for multi-valued logic computing applications.
- To achieve negative differential transconductance (NDT) without complex fabrication.
Main Methods:
- Hydrothermal synthesis of Te nanoflakes.
- Encapsulation of Te nanoflakes in an Al2O3 thin film using thermal atomic layer deposition.
- Fabrication and characterization of Te transistor-based ternary inverters.
Main Results:
- The Te nanofilm transistor exhibited ambipolar behavior and distinct negative differential transconductance (NDT) characteristics.
- The device demonstrated transitions through hole diffusion, band-to-band tunneling, and electron conduction, driven by Fermi level modulation.
- A Te transistor-based ternary inverter successfully achieved three stable logic states with a clear intermediate voltage.
Conclusions:
- The developed Te-based NDT transistors offer a promising pathway for next-generation computing architectures.
- These transistors enable high-data-density and energy-efficient operations.
- The simplified fabrication process enhances the potential for practical integration and scalability.
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