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Related Concept Videos

Metallic Solids02:37

Metallic Solids

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Metallic solids such as crystals of copper, aluminum, and iron are formed by metal atoms. The structure of metallic crystals is often described as a uniform distribution of atomic nuclei within a “sea” of delocalized electrons. The atoms within such a metallic solid are held together by a unique force known as metallic bonding that gives rise to many useful and varied bulk properties.
All metallic solids exhibit high thermal and electrical conductivity, metallic luster, and malleability....
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Metal-Semiconductor Junctions01:24

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The contact of metal and semiconductor can lead to the formation of a junction with either Schottky or Ohmic behavior.
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Schottky barriers arise when a metal with a work function (Φm) contacts a semiconductor with a different work function (Φs). Initially, electrons transfer until the Fermi levels of the metal and semiconductor align at equilibrium. For instance, if Φm > Φs, the semiconductor Fermi level is higher than the metal's before contact. The...
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Bonding in Metals02:32

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Metallic bonds are formed between two metal atoms. A simplified model to describe metallic bonding has been developed by Paul Drüde called the “Electron Sea Model”. 
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  1. Home
  3. Research Domains
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  7. Materials Engineering
  9. Wearable Materials
  11. Atomic Layer-deposited Interlayers For Robust Metal-polymer Interfaces.
  1. Home
  3. Research Domains
  5. Engineering
  7. Materials Engineering
  9. Wearable Materials
  11. Atomic Layer-deposited Interlayers For Robust Metal-polymer Interfaces.

Related Experiment Video

Author Spotlight: Exploring Self-Assembled MOF-Polymer Composites
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Author Spotlight: Exploring Self-Assembled MOF-Polymer Composites

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Atomic Layer-Deposited Interlayers for Robust Metal-Polymer Interfaces.

Johanna Byloff1,2, Claus Othmar Wolfgang Trost3, Vivek Devulapalli1

  • 1Empa, Swiss Federal Laboratories for Materials Science and Technology, Laboratory for Mechanics of Materials and Nanostructures, Feuerwerkerstrasse 39, Thun 3603, Switzerland.

ACS Applied Materials & Interfaces
|July 8, 2025

View abstract on PubMed

Summary
This summary is machine-generated.

Researchers improved flexible electronics by adding an aluminum oxide/hydroxide (AlOxHy) interlayer. This interlayer enhances adhesion and mechanical properties of aluminum films on polyimide, enabling better performance in flexible devices.

Keywords:
adhesionatomic layer depositionelectromechanical propertiesflexible substrates

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Area of Science:

  • Materials Science
  • Surface Science
  • Mechanical Engineering

Background:

  • Flexible electronics and space applications require robust metal thin films on polymer substrates.
  • Film cracking and interfacial delamination are critical limitations in current flexible device technologies.

Purpose of the Study:

  • To enhance the adhesion and electromechanical properties of aluminum films on polyimide substrates.
  • To investigate the role of an amorphous aluminum oxide/hydroxide (AlOxHy) interlayer in improving film-substrate integrity.

Main Methods:

  • Magnetron sputtering for aluminum film deposition.
  • Atomic Layer Deposition (ALD) for the amorphous AlOxHy interlayer.
  • In situ X-ray diffraction and electrical resistance measurements during uniaxial and equi-biaxial tensile testing.
tensile testing
thin films

Main Results:

  • An up-to-3-fold increase in crack onset and electronic failure strains was observed.
  • Adhesion energy of the metal-polymer system was doubled.
  • The AlOxHy interlayer shifted interface deformation mechanisms from absorbing to blocking dislocations.

Conclusions:

  • The integrated ALD-PVD approach significantly enhances the strain tolerance and adhesion of aluminum films on polyimide.
  • The strengthened interface improves electromechanical stability, enabling flexible devices to withstand greater deformation.
  • This method offers new possibilities for durable flexible electronics conforming to complex surfaces.