Thin-Film Encapsulation for OLEDs and Its Advances: Toward Engineering

Thin-film encapsulation has been a critical method to realize small-size OLED displays. However, the manufacturing of large-size flexible OLED is still in the preparatory phase prior to commercialization, which entails more rigorous demands for reliability and flexibility with regard to thin-film encapsulation. This review, from the perspective of engineering for mass production, addresses the development of thin-film encapsulation and its three core properties for comprehensive validation while engineering, including basic properties, reliability, and compatibility. Moreover, considering the prospective evolution of display products, the review on novel thin-film encapsulation was conducted to evaluate the potential engineering value for thinning, ultra-flexibility, multifunctionality, novel equipment, and emerging technology. It is anticipated that some of the aforementioned technologies may prove to be of significant engineering value. It is therefore hoped that by comprehensive engineering verification, the commercial application of novel thin-film encapsulation can be promoted and the competitiveness of OLED products can be effectively enhanced.