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Published on: June 23, 2017
MXene-Based Electromagnetic Interference Shielding Materials: A Leap From Fundamental Research to Intelligent
Hao Hu1,2, Shuo Wang3, Yiming Zhang1,2
1School of Integrated Circuits, East China Normal University, Shanghai, 200241, China.
MXene-based materials offer advanced electromagnetic interference (EMI) shielding with high effectiveness and low density. This review highlights their intelligent customization and future potential for next-generation electronics.
Area of Science:
- Materials Science
- Nanotechnology
- Electrical Engineering
Background:
- Current electromagnetic interference (EMI) shielding materials face limitations in customization and application flexibility.
- MXene-based materials show promise due to high electrical conductivity, tunable surface chemistry, and solution processability.
- There is a growing demand for efficient, lightweight, and flexible EMI shielding solutions for advanced electronic devices.
Purpose of the Study:
- To review key developments in MXene-based EMI shielding materials from 2016 to 2024.
- To outline recent advances in intelligent customization, AI-assisted design, and broadband shielding applications.
- To provide strategic insights into future directions and prospects for MXene-based EMI shielding materials.
Main Methods:
- Comprehensive literature review of MXene-based EMI shielding research.
- Analysis of experimental data on shielding effectiveness, density, and specific shielding effectiveness.
- Highlighting advancements in material design, processing, and application-specific integration.
Main Results:
- MXene-based composites achieve EMI shielding effectiveness (SE) over 80 dB.
- Ultralow densities below 0.1 g cm-3 and high specific shielding effectiveness (SSE/t) exceeding 30,000 dB·cm2 g-1 are reported.
- Progress in AI-assisted design, GHz-THz broadband shielding for 6G, and multifunctional systems is evident.
Conclusions:
- MXene-based materials represent a significant advancement in EMI shielding technology.
- Intelligent customization and integration with AI are key to unlocking their full potential.
- These materials are poised for widespread application in next-generation electronic devices and systems.
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