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Updated: Sep 13, 2025

Fabrication and Testing of Photonic Thermometers
Published on: October 24, 2018
Geoffrey Chancel1, Julien Toulemont2, Frederick Mailly1
1LIRMM, University of Montpellier, 34095 Montpellier, France.
This study introduces an affordable method to verify integrated circuit (IC) package integrity at power-up. It uses built-in thermal sensors to indirectly measure heat dissipation, enhancing hardware security.
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