Methodology and pilot implementation of modular educational-development platform for Interoperable Digital Twin

Area of Science:

• Industrial Engineering
• Computer Science
• Manufacturing Systems

Background:

• Industry 4.0 emphasizes interoperability and digital twins (DT).
• Integrating physical assets with digital representations (Asset Administration Shells - AAS) is crucial.
• Existing solutions often lack comprehensive integration of key Industry 4.0 attributes.

Purpose of the Study:

• To propose a methodology for an Education and Development Platform (EDP) for Interoperable Digital Twins (I-DT).
• To demonstrate the integration of virtualization, interoperability (OPC UA), and Industry 4.0 Components (AAS).
• To validate the platform's feasibility through pilot implementation on industrial technologies.

Main Methods:

• Development of a methodology for an I-DT platform.
• Implementation of the platform using open and affordable technologies.
• Pilot testing on industrial technologies to assess functionality.

Main Results:

• Successful creation of an Education and Development Platform (EDP) for Interoperable Digital Twins (I-DT).
• The platform effectively combines virtualization, OPC UA-based interoperability, and AAS integration.
• Pilot implementation confirmed the platform's adherence to Industry 4.0 principles like interoperability, virtualization, reconfigurability, and modularity.

Conclusions:

• The proposed methodology enables the development of integrated I-DT platforms.
• The I-DT platform provides a viable solution for education and development in Industry 4.0.
• The platform's use of open technologies makes it accessible and scalable for industrial applications.