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Published on: December 5, 2015
Interfacial Anchoring and Dual-Phase Separation Tame Liquid Metal into a NIR-Responsive Conductive Adhesive for
Lu Fu1, Jun Fang1, Chenhao Ji1
1State Key Laboratory of Supramolecular Structure and Materials, College of Chemistry, Jilin University, Qianjin Avenue 2699, Changchun 130012, China.
Abstract:
We present a near-infrared (NIR)-weldable and recyclable conductive adhesive through solvent-free integration of a liquid metal (LM) with polythioctic acid (pTA). The strong thiol/carboxyl-mediated binding enables 70 wt % LM loading within the pTA matrix while preventing leakage. Crystallization of incompletely polymerized TA monomers generates microphase domains that enhance the bulk cohesion of pTA/LM, achieving an adhesion strength exceeding 1.8 MPa. Concurrently, LM-induced macrophase separation creates percolated networks enabling isotropic conductive pathways (2.29 × 104 S m-1) and efficient NIR photothermal conversion capability. By coupling the plasmonic heating from macrophase-separated LM with thermotropic adhesiveness of pTA, the resulting pTA/LM adhesive demonstrates rapid NIR welding capability for electronics interconnection through remote, noninvasive NIR irradiation. Notably, the dynamic disulfide bonds in pTA enable chemical degradation under mild conditions, facilitating the closed-loop recycling and reutilization of both LM and TA monomers. This NIR-responsive conductive adhesive prototype offers an eco-friendly solution for miniaturization assembly and sustainable microelectronics manufacturing.
