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Updated: Sep 12, 2025

Preparation of Binary and Ternary Deep Eutectic Systems
Published on: October 31, 2019
Temperature-Dependent Molecular Diffusional Properties in Deep Eutectic Solvents and Eutectogels
Hayley P Masching1,2, Nicole M Stephens1,2, Nabeel Mujtaba Abbasi1,2
1Ames National Laboratory, U.S. Department of Energy, Ames, Iowa 50011-3111, United States.
Abstract:
Eutectogels (ETGs) prepared from deep eutectic solvents (DESs), a gelator, and water have many uses in separations, catalysis, and energy storage systems. In these applications, temperature-dependent molecular diffusional properties and intermolecular interactions play a critical role in their function. Diffusional properties of Alexa Fluor 633 and ATTO 647N were measured across a range of temperatures in choline chloride:2glycerol DESs comprised of one molar equivalent of choline chloride and two molar equivalents of glycerol (also known as glyceline) as well as ETGs made from this DES, a xanthan gum gelator, and 10% w/w water or 20% w/w water. Fluorescence recovery after photobleaching (FRAP) was employed to evaluate potential changes in molecular diffusion within DESs and ETGs from 20 to 100 °C. Surprisingly, the ETGs have a larger sample viscosity but also exhibit faster molecular diffusion when compared to the dry DES. This is attributed to macroscopic properties of the ETGs (e.g., pores, three-dimensional structure). The FRAP data also show an irreversible temperature-dependent decrease in the diffusion coefficient of both fluorophores in the ETGs. This is consistent with differential scanning calorimetry data of the ETG, which shows a shift to a more negative glass transition temperature (-36 °C to -47 °C) after the first cooling/heating cycle. Raman data reveal no detectable changes in the intermolecular interactions in either the DESs or ETGs as a function of temperature or water content. The findings on temperature- and water-dependent diffusional properties of DESs and ETGs provide a foundation for optimizing the use of these materials across various applications, particularly where repeated heating/cooling cycles may be used.
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