Design, fabrication, testing, and packaging of the 1 × 8 power splitter developed under the SOI platform

This paper presents a brief roadmap to design and fabricate a final device corresponding to a 1×8 power splitter developed under the silicon-on-insulator (SOI) platform. To describe the entire technological process for the power splitter, first, we begin by designing and validating our proposed photonic circuit through calculations using several computational routines supported by popular numerical methods, such as the finite-difference time-domain (FDTD) and beam propagation methods (BPM). In the second step, the technological platform employed for fabricating the designed optical circuit is briefly described. Subsequently, the primary objective of this paper is presented, which is to provide a detailed introduction and explanation of the assembly process, including the positioning and coupling of the optical signal to the chip and the integration of all components. Additionally, we developed the packaging process, designing the case to include internal pieces and the external housing suitable for the final system, including fiber optics input/output interfaces. In this final step, all internal and cover components for the packaging were fabricated using 3D printing.