Compact deep-groove-assisted bends on SiN platform for monolithic integrated laser

To build a photonic integration platform that incorporates monolithically integrated light sources which require minimized loss and reflection, a micro-meter scale passive layer is needed in addition to the III-V layer. Low temperature plasma-enhanced chemical vapor deposition (PECVD) silicon nitride (SiN) is a promising candidate, owing to its back-end-of-line (BEOL) integration capabilities, along with its amorphous structure that allows the growth of defect-free thick layers. In view of the III-V layer stack, the optimized SiN waveguides are thick and in a rib formation. However, bends on this thick SiN platform suffer from high radiation losses, resulting in the need for a bending radius as large as 800 µm that poses challenges for compact photonic integrated circuits (PICs). This paper describes and demonstrates a novel SiN bending structure with a deep etched groove along the outer side. This structure significantly reduces the bending radii to 37 µm with a bending loss of 0.1 dB/90°. A compact micro-ring resonator (MRR) with deep etched grooves is also investigated, exhibiting a substantial enhancement in the free spectral range (FSR) compared with the rib waveguide MRRs, while offering a passband of 39.1 GHz. These notable performance improvements pave the way for compact integrated emitters on a single substrate.