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Dual-strategy-guided 2D wavelet transform for single-exposure high dynamic range 3D shape measurement.

Mengqi Han, Wenjing Chen, Qican Zhang

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    This study introduces a novel dual-strategy wavelet transform for high dynamic range 3D shape measurement using fringe projection profilometry. The method effectively addresses challenges from varying surface reflectivity in single-exposure measurements.

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    Area of Science:

    • Optics and Photonics
    • Computer Vision and Image Processing
    • Metrology

    Background:

    • Fringe projection profilometry (FPP) is a key non-contact 3D measurement technique.
    • Challenges arise from varying surface reflectivity causing underexposure and overexposure.
    • Existing methods struggle with high dynamic range (HDR) scenes in single-exposure FPP.

    Purpose of the Study:

    • To develop a novel method for high dynamic range (HDR) 3D shape measurement in fringe projection profilometry (FPP).
    • To overcome limitations of varying surface reflectivity and achieve accurate measurements in single-exposure scenarios.

    Main Methods:

    • A dual-strategy-guided two-dimensional (2D) wavelet transform is proposed for fringe analysis.
    • The method utilizes wavelet function expressions and spectral intensity distributions to guide wavelet spectrum rotation.
    • A single projector and single camera system is employed for efficient phase calculation.

    Main Results:

    • Simulations and experiments validate the proposed method's feasibility for HDR 3D shape measurement.
    • Quantitative analysis on standard planes and HDR scenes demonstrates effectiveness.
    • The method provides a novel solution for single-exposure HDR 3D shape measurement.

    Conclusions:

    • The dual-strategy-guided wavelet transform offers a robust solution for single-exposure HDR 3D shape measurement.
    • This technique enhances the applicability of FPP in complex real-world scenarios with challenging reflectivity.
    • The proposed method represents a significant advancement in accurate and efficient 3D metrology.