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Related Concept Videos

Stress Concentrations01:24

Stress Concentrations

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Stress concentration is when stress intensifies near discontinuities such as holes or abrupt cross-sectional changes in a structural member. This localized stress can often surpass the average stress within the member. The stress distribution in flat bars, either with a circular hole or varying widths connected by fillets, can be determined experimentally using a photoelastic method. The results are based on ratios of geometric parameters like the ratio of the hole's radius to the smaller...
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Stresses under Combined Loadings01:23

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When analyzing a bent tube with a circular cross-section subjected to multiple forces, it is crucial to determine the stress distribution in order to maintain structural integrity under varied load conditions.
The process begins by slicing the tube at critical points and analyzing the internal forces and stress components at these sections, focusing on the centroid. Normal stresses, generated by axial forces and bending moments, are either compressive or tensile and vary across the section from...
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Bending of Members Made of Several Materials01:08

Bending of Members Made of Several Materials

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In analyzing a structural member composed of two different materials with identical cross-sectional areas, it is crucial to understand how their distinct elastic properties affect the member's response under load. The analysis involves assessing stress and strain distributions using the transformed section concept, which accounts for variations in material properties.
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Stress-Strain Diagram - Ductile Materials01:24

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The stress-strain relationship in ductile materials such as structural steel or aluminium is intricate and progresses through several stages. When a specimen is loaded, it initially exhibits a linear length increase, depicted by a steep straight line on the stress-strain diagram. It indicates the material is elastically deforming and will return to its original shape once unloaded. However, when a critical stress value is reached, plastic deformation begins. This stage sees substantial...
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Flexural Stress01:16

Flexural Stress

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When analyzing bending in symmetric members, it's crucial to understand how stresses distribute when subjected to bending moments. This stress distribution is effectively described by applying fundamental mechanics and material science principles, particularly Hooke's Law for elastic materials.
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Thermal expansion and Thermal stress: Problem Solving01:27

Thermal expansion and Thermal stress: Problem Solving

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San Francisco's Golden Gate Bridge is exposed to temperatures ranging from -15 °C to 40 °C. At its coldest, the main span of the bridge is 1275 m long. Assuming that the bridge is made entirely of steel, what is the change in its length between these temperatures?
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  11. Hygrothermal Stress Analysis Of Epoxy Molding Compound In Fan-out Panel-level Package Based On Experimental Characterization And Structural Sensitivity

Hygrothermal Stress Analysis of Epoxy Molding Compound in Fan-Out Panel-Level Package Based on Experimental Characterization and Structural Sensitivity

Yu-Chi Sung1, Chih-Ping Hu1, Sheng-Jye Hwang1

  • 1Department of Mechanical Engineering, National Cheng Kung University, Tainan 70101, Taiwan.

Polymers
|August 14, 2025

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View abstract on PubMed

Summary
This summary is machine-generated.

Fan-out panel-level packaging reliability is crucial. This study found thermal effects significantly impact hygrothermal stress more than moisture, with design optimization reducing stress by 12.4%.

Area of Science:

  • Materials Science
  • Mechanical Engineering
  • Semiconductor Packaging

Background:

  • Fan-out panel-level packaging is key for next-gen electronics.
  • Hygroscopic epoxy molding compounds pose reliability risks due to moisture absorption.
  • Understanding hygrothermal stress is vital for package integrity.

Purpose of the Study:

  • Investigate hygrothermal stress in single fan-out panel-level package units.
  • Quantify the impact of moisture and temperature on epoxy molding compounds.
  • Provide design insights for enhanced package reliability.

Main Methods:

  • Experimental characterization of epoxy molding compounds.
  • Thermal-mechanical analysis at 100 °C and 260 °C.
  • Moisture-thermal coupled finite element analysis (FEA).
Keywords:
fan-out panel-level packaginghygrothermal stressmoisture effectreliability

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Main Results:

  • Calculated coefficient of moisture expansion under MSL1 conditions (85 °C/85% RH).
  • FEA simulations accurately predicted stress concentrations at die corners.
  • Thermal effects were found to be more dominant than moisture effects on stress development.

Conclusions:

  • Optimizing die and epoxy molding compound thickness can reduce maximum principal stress by up to 12.4%.
  • Design modifications offer a pathway to improve the reliability of fan-out panel-level packages.
  • This research provides critical data for designing more robust electronic packages.
structural sensitivity analysis