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Laser-induced Forward Transfer for Flip-chip Packaging of Single Dies

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Flat-panel laser displays through large-scale photonic integrated circuits.

Zhujun Shi¹, Risheng Cheng¹, Guohua Wei¹

¹Reality Labs Research, Meta Platforms, Inc., Redmond, WA, USA.

|August 21, 2025

Summary

Researchers developed a novel, ultra-thin laser display using photonic integrated circuits (PICs). This technology significantly reduces display size and enhances colour performance for applications like augmented reality (AR).

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Area of Science:

Optoelectronics
Photonics
Display Technology

Background:

Laser displays offer superior brightness and color performance, crucial for advanced applications like augmented reality (AR).
Widespread adoption of laser displays is limited by bulky projector designs and complex optical assemblies.
Existing laser display technologies often struggle with uniformity, contrast, and efficiency.

Purpose of the Study:

To introduce a new laser display architecture that overcomes the limitations of traditional designs.
To enable an ultra-thin, flat-panel form factor for laser displays.
To leverage large-scale visible photonic integrated circuits (PICs) for enhanced display performance.

Main Methods:

Developed centimeter-scale PICs integrating thousands of optical components on-chip.
Designed a novel flat-panel laser display architecture replacing bulky free-space modules with a single PIC.
Integrated the PIC with a liquid-crystal-on-silicon (LCoS) panel to create a 2-mm-thick display prototype.

Main Results:

Demonstrated a 2-mm-thick flat-panel laser display with significantly reduced volume (over 80% reduction).
Achieved superior color performance, exceeding traditional LCoS displays by 211% in color gamut.
Showcased high display uniformity, contrast, and efficiency enabled by the integrated photonic chip.

Conclusions:

The novel PIC-enabled laser display architecture offers a path towards ultra-thin, high-performance displays.
This advancement integrates nanophotonics with display technology, enabling new display concepts.
The technology is suitable for high-performance immersive displays and slim-panel 3D holography, including see-through AR systems.