Related Experiment Video
Updated: May 1, 2026
13:44
Simulation, Fabrication and Characterization of THz Metamaterial Absorbers
Published on: December 27, 2012
15.5K
High-Strength, Thermally Stable Phthalazinone-Containing Bismaleimide Composites Engineered for Electronic Packaging
Runze Liu1,2, Jianjian Jiao1,2, Yuhang Wang1,2
1State Key Laboratory of Fine Chemicals and Department of Polymer Science and Engineering, Dalian University of Technology, Dalian 116024, China.
ACS Applied Materials & Interfaces
|August 25, 2025
Summary
New bismaleimide (BMI) composites offer superior thermal resistance and mechanical strength for advanced electronic packaging. These materials address heat accumulation and signal interference challenges in high-performance computing applications.
Area of Science:
- Materials Science
- Polymer Chemistry
- Electronic Packaging
Background:
- AI computations demand advanced electronic packaging with miniaturization and high stability.
- Current packaging materials face challenges like heat accumulation, rigidity issues, and signal interference.
- There is a critical need for materials with high thermal resistance, flexural modulus, and dielectric properties.
Purpose of the Study:
- To develop novel composite materials for state-of-the-art electronic packaging.
- To synthesize and characterize bismaleimide (BMI)-terminated poly(phthalazinone ether nitrile ketone) (PPENKBMI) composites.
- To evaluate the thermal, mechanical, and dielectric properties of these new composites.
Main Methods:
- Molecular design and synthesis of PPENKBMI.
- Utilized a biphenyl-structured curing agent (DABP) and compounded with 4,4'-bismaleimidodiphenylmethane (BDM).
- Evaluated thermal resilience (Tg), flexural modulus, flexural strength, and dielectric constant (at 10 GHz).
Main Results:
- Achieved outstanding thermal resilience with glass transition temperature (Tg) exceeding 300 °C.
- Exhibited a high flexural modulus of 52.3 GPa and flexural strength of 660.4 MPa.
- Demonstrated a diminished dielectric constant of 4.2 at 10 GHz due to robust skeletal architecture and augmented free volume.
Conclusions:
- The developed PPENKBMI/DABP/BDM composites offer exceptional thermal resistance, mechanical strength, and low dielectric properties.
- These materials show promising performance in processability, thermal durability, peel strength, and coefficient of thermal expansion control.
- The novel resin composite holds substantial promise for next-generation electronic packaging applications.
