Simulation and verification of Micro-LED multi-physics field coupling based on augmented reality head-up display

Area of Science:

• Optoelectronics
• Materials Science
• Thermal Management

Background:

• Augmented Reality Heads-up Displays (AR-HUDs) require efficient micro light-emitting diodes (Micro-LEDs).
• High junction temperatures negatively impact Micro-LED performance and reliability.
• Effective thermal management is crucial for advanced display technologies.

Purpose of the Study:

• To design and optimize a blue-green Micro-LED for AR-HUD applications.
• To investigate the thermal management strategies for Micro-LEDs using graphene films and heat sinks.
• To analyze the impact of graphene film thickness and operating conditions on heat dissipation and device performance.

Main Methods:

• COMSOL software was used for Micro-LED design and multi-physical field simulation.
• Photo-thermal properties were coupled with thermal management simulations.
• Graphene film thickness and heat sink integration were optimized for heat dissipation.
• The effect of source power input and contact area ratio on thermal performance was analyzed.
• Reverse solar scattering effects were calculated based on solar energy density.

Main Results:

• Optimized thermal management using graphene film and heat sinks significantly improved heat dissipation.
• Graphene film thickness was found to influence heat dissipation performance.
• Increased power input and decreased contact area ratio led to more pronounced thermal performance changes.
• Solar radiation was shown to dramatically increase Micro-LED surface radiation, indicating a potential sunlight backflow issue.

Conclusions:

• The developed thermal management scheme effectively reduces junction temperature, improving Micro-LED photoelectric conversion efficiency.
• The study provides a basis for addressing sunlight backflow issues in Micro-LED modules.
• Optimized Micro-LEDs with enhanced thermal management are suitable for AR-HUD applications.