Effects of Electromigration on Sn-Bi Lead-Free Solder Alloy Joints on Copper and Copper with Nickel Surface Finish

Electromigration (EM) is a critical reliability concern in electronic solder joints due to increasing current densities in modern electronic packaging. EM-induced failures often manifest as void formation and microstructural degradation, particularly at the cathode interface. To address this issue, composite solder joints with elemental additions have been explored to enhance performance under high current stress. This study investigates the effect of Zn addition on the electromigration behavior and mechanical performance of eutectic Sn-Bi solder joints on copper (Cu) and nickel-coated copper (Ni/Cu) substrates. The solder alloys 58Sn-42Bi and Zn-modified Sn-Bi were prepared and reflowed onto the substrates. Electromigration testing was performed under a constant current of 1000 mA at room temperature, with applied voltages of 5 V, 12 V, and 24 V over a 10-day period per sample. Shear tests were conducted at a crosshead speed of 0.1 mm/min to evaluate joint strength. The results revealed that Zn addition influenced the distribution of Bi within the solder matrix, reducing Bi depletion at the cathode and mitigating accumulation at the anode, suggesting improved EM resistance. Zn-containing solder joints also demonstrated enhanced shear strength compared to unmodified Sn-Bi joints. These findings highlight the potential of Zn as a beneficial alloying element for improving the reliability of lead-free solder joints and form a foundation for future studies incorporating phase analysis and predictive EM lifetime modelling.