High Thermal Conductivity Diamond-Copper Composites Prepared via Hot Pressing with Tungsten-Coated Interfacial Layer
Qiang Wang1,2, Zhijie Ye3, Lei Liu1
1School of Aeronautics, Chongqing Jiaotong University, Chongqing 400074, China.
Materials (Basel, Switzerland)
|August 28, 2025
Summary
Researchers enhanced diamond-copper composites for electronic thermal management. Tungsten interlayers improved bonding and thermal conductivity to 640 W/(m·K), the highest for composites under 50% diamond content via hot-press sintering.
Area of Science:
- Materials Science
- Nanotechnology
- Thermal Engineering
Background:
- Diamond-copper composites offer superior thermal conductivity for electronic thermal management.
- Hot-press sintering is a viable fabrication method, but composite thermal conductivity needs improvement.
Purpose of the Study:
- To enhance the thermal conductivity of diamond-copper composites fabricated by hot-press sintering.
- To investigate the role of tungsten interfacial layers in improving interfacial bonding and thermal performance.
Main Methods:
- Magnetron sputtering of tungsten onto diamond particles.
- Hot-press sintering of diamond-copper composites.
- Analysis of interfacial structures and thermal properties using Acoustic Mismatch Model (AMM) and Diffusion Mismatch Model (DMM).
Main Results:
- Tungsten transformed into W2C and WC during annealing, strengthening the diamond-copper interface.
- A composite with 50% diamond content and a specific W/WC/W2C interfacial coating achieved 640 W/(m·K) thermal conductivity.
- This represents the highest thermal conductivity for hot-press sintered composites with <50% diamond content.
Conclusions:
- The optimized diamond/W2C/WC/W2C/Cu interface significantly boosts thermal conductivity.
- These composites are promising for high-power electronic cooling and thermal management.
- The study provides an efficient thermal dissipation solution for advanced electronic devices.
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