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High Thermal Conductivity Diamond-Copper Composites Prepared via Hot Pressing with Tungsten-Coated Interfacial Layer

Qiang Wang1,2, Zhijie Ye3, Lei Liu1

  • 1School of Aeronautics, Chongqing Jiaotong University, Chongqing 400074, China.

Materials (Basel, Switzerland)
|August 28, 2025
PubMed
Abstract

Keywords:
diamond–copper compositeshot-pressinginterfacial thermal conductancethermal conductivity

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