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Optimized Sealing Process and Real-Time Monitoring of Glass-to-Metal Seal Structures

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Investigation on the Interfacial Delamination of Glass Substrate Packaging Using Cohesive Zone Models.

Tianzuo Qin¹, Wen Yang¹, Qiqin Wei¹

¹School of Mechanical and Electrical Engineering, Guilin University of Electronic Technology, Guilin 541004, China.

|August 28, 2025

Summary

This study analyzes glass substrate packaging delamination using experiments and simulations. It establishes a cohesive zone model to predict interface strength and assess reliability under thermal stress.

Keywords:

CZM crack initiation and propagation delamination assessment glass substrates

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Area of Science:

Materials Science
Mechanical Engineering
Semiconductor Packaging

Background:

Glass substrate packaging is a growing trend in electronic devices.
Understanding interface delamination is crucial for packaging reliability.
Accurate characterization of material interfaces is needed.

Purpose of the Study:

To analyze the delamination behavior of the substrate-adhesive layer-chip structure in glass substrate packaging.
To establish a cohesive zone model for predicting crack initiation and propagation.
To evaluate the reliability and delamination risks of the packaging structure.

Main Methods:

Experimental testing to obtain interface strength parameters and load-displacement curves.
Iterative combination of experiments and simulations to develop a cohesive zone model.
Simulation analysis using calibrated cohesive parameters to assess thermal delamination risks.

Main Results:

Experimentally determined critical load values for interface delamination.
Clear observation of delamination locations within the packaging structure.
Acquired cohesive parameters accurately reflect interface strength for fracture evaluation.

Conclusions:

The developed cohesive zone model effectively characterizes interface delamination in glass substrate packaging.
The study provides a reliable method for assessing packaging reliability under thermal conditions.
This research supports the advancement of robust glass substrate packaging technologies.