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Enhancing Interlayer Bonding in DLP-Printed Piezoelectric Ceramics via Controlled Secondary Curing for High
Yaoting Zhao1, Ruihang Liu1, Wenlong Wang2
1Shandong Provincial Key Laboratory of Green and Intelligent Building Materials, University of Jinan, Jinan, 250022, China.
Advanced Science (Weinheim, Baden-Wurttemberg, Germany)
|September 5, 2025
Summary
This study introduces an interfacial engineering strategy for 3D printing piezoelectric components using Digital Light Processing (DLP). This method enhances interlayer bonding, significantly improving piezoelectric properties for advanced sensor applications.
Area of Science:
- Materials Science
- Additive Manufacturing
- Piezoelectric Ceramics
Background:
- Digital Light Processing (DLP) is a key additive manufacturing technique for fabricating complex piezoelectric components.
- Interlayer cracking in DLP-printed ceramics degrades piezoelectric sensor performance.
- Advanced piezoelectric materials are crucial for high-sensitivity sensing systems.
Purpose of the Study:
- To develop an interfacial engineering strategy for 3D printing piezoelectric components with enhanced performance.
- To overcome interlayer cracking issues in DLP-fabricated piezoelectric ceramics.
- To achieve superior piezoelectric properties in 3D-printed superlattice structures.
Main Methods:
- Utilized Digital Light Processing (DLP) for additive manufacturing of piezoelectric components.
- Implemented an interfacial engineering strategy involving controlled secondary curing.
- Optimized layer exposure time to improve surface characteristics and interlayer bonding.
Main Results:
- Achieved optimal interlayer bonding in t-20 ceramics.
- Obtained a high piezoelectric constant (d33) of 516 ± 8 pC·N−1, comparable to commercial ceramics.
- Demonstrated an ultra-high piezoelectric response with an open-circuit voltage of 493 V at 17.3 N.
- Exhibited high pressure sensitivity (27.9 V·N−1) and response to faint loads (0.1 N).
Conclusions:
- The developed interfacial engineering strategy effectively enhances interlayer bonding in DLP-printed piezoelectric components.
- The superlattice piezoelectric components exhibit exceptional piezoelectric performance and mechanical properties.
- This advancement enables reliable non-contact dynamic monitoring and opens new possibilities for advanced sensing applications.
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