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Improving Printed and Thermoformed Conductors on Polycarbonate with a Thin-Film BNNT Interlayer for Next-Generation
Kaitlin Wagner1,2, Arnold J Kell2, Xiangyang Liu2
1Chemical and Biological Engineering, University of Ottawa, 161 Louis Pasteur, Ottawa, Ontario K1N 6N5, Canada.
Thin-film boron nitride nanotube (BNNT) interlayers enhance electrical conductivity and thermal management for 3D-printed electronics. This study shows BNNT interlayers improve 3D conductive traces, preventing thermal failure in temperature-sensitive applications.
Area of Science:
- Materials Science
- Electrical Engineering
- Nanotechnology
Background:
- Thermoforming 2D-printed electronics into 3D structures can cause defects, impacting electrical performance and leading to thermal failure.
- High electrical power/current applications on temperature-sensitive substrates exacerbate these issues.
Purpose of the Study:
- To investigate the use of thin-film boron nitride nanotube (BNNT) interlayers to mitigate heat stress and improve electrical performance of thermoformed 3D conductive traces.
- To evaluate the thermal protection and conductivity enhancement provided by BNNT interlayers on metallic traces on polycarbonate substrates.
Main Methods:
- Thermoforming 2D metallic traces on polycarbonate substrates into 3D spherocylindrical geometries at varying elongation percentages.
- Incorporating a thin-film BNNT interlayer between the metallic traces and the substrate.
- Measuring electrical conductivity and analyzing localized resistance increases and substrate thinning.
- Assessing thermal performance under high current and voltage applications.
Main Results:
- BNNT interlayers improved the electrical conductivity of highly elongated thermoformed 3D traces compared to bare polycarbonate substrates.
- Localized substrate thinning at high elongation correlated with increased trace resistance and hot spot formation.
- BNNT interlayers provided thermal protection, allowing substrates to withstand temperatures 1.5 times higher than bare substrates under high current.
Conclusions:
- BNNT interlayers are effective thermal management materials for 3D-printed electronics.
- The use of BNNT interlayers facilitates the development of more reliable and higher-performing conductive metal traces for 3D electronics and in-mold electronics.
- BNNT interlayers mitigate defects introduced during thermoforming, enhancing the durability and performance of 3D conductive pathways.
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