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Standardized Metrics for Polydimethylsiloxane Bonding: Rupture Pressure-Stress Correlation in Air Plasma-Activated

Cheng-Fu Chen¹

¹Department of Mechanical Engineering, University of Alaska Fairbanks, Fairbanks, Alaska 99775-5905, United States.

Langmuir : the ACS Journal of Surfaces and Colloids

|September 12, 2025

Summary

This study presents a new method to evaluate bonding strength in PDMS devices using a geometry-correlated scaling function. Air plasma treatment offers a stable and effective alternative to oxygen plasma for robust interfacial bonding.

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Area of Science:

Materials Science
Surface Science
Microfluidics

Background:

Reliable bonding of polydimethylsiloxane (PDMS) is crucial for microfluidic and flexible electronic devices.
Surface activation methods significantly influence the strength of interfacial bonding in PDMS.

Purpose of the Study:

To introduce a standardized method for evaluating interfacial bonding strength across different platforms.
To assess the effectiveness of air plasma treatment as an alternative to oxygen plasma for PDMS bonding.

Main Methods:

Development of a geometry-correlated scaling function to convert rupture pressure to maximum von Mises stress.
Assessment of air plasma treatment efficacy using hydrophilicity measurements, adhesion testing, rupture experiments, and thermal postbonding treatment.
Evaluation of bonding stability through aging studies.

Main Results:

The developed framework establishes a material threshold for interfacial bonding strength.
Postbonding incubation achieved interfacial stresses of 60-120 psi (414-827 kPa) with air plasma treatment.
Strain energy release rate (SERR) values were consistent with the rupture configuration, and aging studies confirmed stable long-term bonding with mild air plasma exposure.

Conclusions:

Air plasma treatment is a viable and effective alternative to oxygen plasma for robust PDMS interfacial bonding.
The developed protocol provides a transferable and consistent method for evaluating interfacial bonding performance based on rupture stress.