Advances of Welding Technology of Glass for Electrical Applications

Glass, as an amorphous material with excellent optical transparency and chemical stability, plays an irreplaceable role in modern engineering and technology fields such as semiconductor manufacturing and micro-electro-mechanical systems (MEMS). For example, borosilicate glass, with a coefficient of thermal expansion (CTE) that is close to having good thermal shock resistance and chemical stability, can be applied to MEMS packaging and aerospace fields. SiO₂ glass exhibits excellent thermal stability, extremely low optical absorption, and high light transmittance, while also possessing strong chemical stability and extremely low dielectric loss. It is widely used in semiconductors, photolithography, and micro-optical devices. However, the stress sensitivity of traditional mechanical joints and the poor weather resistance of adhesive bonding make conventional methods unsuitable for glass joining. Welding technology, with its advantages of high joint strength, structural integrity, and scalability for mass production, has emerged as a key approach for precision glass joining. In the field of glass welding, technologies such as glass brazing, ultrasonic welding, anodic bonding, and laser welding are being widely studied and applied. With the advancement of laser technology, laser welding has emerged as a key solution to overcoming the bottlenecks of conventional processes. This paper, along with the application cases for these technologies, includes an in-depth study of common issues in glass welding, such as residual stress management and interface compatibility design, as well as prospects for the future development of glass welding technology.