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Ring-opening metathesis polymerization or ROMP involves strained cycloalkenes as starting materials. The mechanism of ROMP proceeds by reacting cycloalkene with Grubbs catalyst to give metallacyclobutane intermediate which undergoes a ring-opening reaction to form new carbene. The new carbene reacts with another molecule of cycloalkene. Repetition of these steps leads to the formation of an unsaturated open-chain polymer product. All these steps are reversible, however, relieving the ring...

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Surface modification of cycloolefin polymers (COPs) using plasma treatment enhances copper adhesion for flexible electronics. This method improves interfacial bonding and thermal durability, crucial for advanced antenna and circuit board applications.

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Area of Science:

  • Materials Science
  • Surface Chemistry
  • Polymer Engineering

Background:

  • Cycloolefin polymers (COPs) are promising flexible substrates for antennas and circuits in beyond 5G and IoT devices.
  • COP surfaces lack reactive groups, hindering adhesion with metals like copper (Cu), essential for fabrication.
  • Existing methods often compromise COP's low surface roughness or chemical inertness.

Purpose of the Study:

  • To develop and optimize a surface modification strategy for enhancing copper-COP interfacial adhesion.
  • To investigate the impact of plasma treatment duration on surface properties and adhesion performance.
  • To elucidate the mechanisms governing adhesion and thermal degradation at the Cu/COP interface.

Main Methods:

  • Low-pressure plasma treatment of COP surfaces.
  • Functional molecular layer deposition.
  • Systematic variation of plasma treatment time (30 s to 10 min).
  • Adhesion testing (peel strength) before and after thermal aging (120°C for 7 days).
  • Surface characterization using atomic force microscopy-nanoscale infrared spectroscopy (AFM-nanoIR).

Main Results:

  • Optimal plasma treatment below 5 min yielded peel strength >1.2 kN/m.
  • Adhesion above 1.0 kN/m was maintained after 7 days of thermal aging at 120°C.
  • AFM-nanoIR revealed interfacial oxidation as a key factor in degradation after thermal exposure.

Conclusions:

  • Plasma-induced surface activation significantly enhances Cu/COP adhesion and thermal durability.
  • Controlled plasma treatment is critical for optimizing metal-polymer bonding on inert substrates.
  • Understanding interfacial oxidation mechanisms is key to developing reliable adhesion strategies for flexible electronics.