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Scalable Solution-processed Fabrication Strategy for High-performance, Flexible, Transparent Electrodes with Embedded Metal Mesh

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MXene Nanofluid-Driven Interfacial Synergy for Next-Generation Anisotropic Conductive Films.

Guoxiang Zhang¹, Peipei Li^1,2, Wei Zhao¹

¹Shaanxi Key Laboratory of High-Orbits-Electron Materials and Protection Technology for Aerospace, School of Advanced Materials and Nanotechnology, Xidian University, Xi'an, Shaanxi 710071, P. R. China.

ACS Applied Materials & Interfaces

|September 18, 2025

Summary

Anisotropic conductive films (ACF) are enhanced using MXene nanofluid (NF) for improved mechanical strength and electrical performance in flexible electronics. This innovation addresses limitations in current materials for advanced applications like foldable displays.

Keywords:

MXene nanofluid anisotropic conductivity epoxy-based anisotropic conductive films mechanical robustness surface functionalization

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Area of Science:

Materials Science
Nanotechnology
Electronics Engineering

Background:

Anisotropic conductive films (ACF) are crucial for high-precision interconnects in flexible electronics.
Existing ACFs face a trade-off between mechanical robustness and electrical/thermal performance, limiting their use in high-end devices.

Purpose of the Study:

To develop a novel strategy for multifunctional enhancement of epoxy-based ACF using covalently bonded core-shell structured MXene nanofluid (NF).
To overcome the limitations of traditional ACFs by improving mechanical properties while maintaining electrical and thermal performance.

Main Methods:

Incorporation of a core-shell structured MXene nanofluid (NF) into an epoxy matrix.
Utilizing multiscale interfacial synergy via covalent siloxane bridging and physical crack deflection.
Characterization of mechanical, electrical, and thermal properties of the modified ACF.

Main Results:

Achieved a 35% increase in bonding strength (25.22 MPa), enhanced tensile strength (10.87 MPa), and 199.12% elongation at break at 10% NF loading.
Maintained directional electrical anisotropy with low Z-axis contact resistance (7.68-7.77 Ω) and high XY-plane insulation resistance (>10^6 Ω).
Demonstrated superior thermal stability with a decomposition temperature (Td, 5%) above 200 °C.

Conclusions:

MXene nanofluid acts as a transformative toughening agent for epoxy-based ACF.
The developed material offers a universal platform for mechanically resilient, flexible electronic packaging.
Validated practical applicability through a proof-of-concept PCB-FPC-FPC multilayer interconnection board for foldable displays and wearable microsensors.