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Material Sensing with Spatial and Spectral Resolution Based on an Integrated Near-Infrared Spectral Sensor and a CMOS

Ben Delaney1, Sjors Buntinx1, Don M J van Elst1

  • 1Department of Applied Physics, Eindhoven Hendrik Casimir Institute, Eindhoven University of Technology, P.O. Box 513NL, 5600 MB Eindhoven, The Netherlands.

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Summary
This summary is machine-generated.

This study introduces a novel standoff material sensing system. It combines visible imaging with targeted near-infrared (NIR) spectral measurements for efficient chemical characterization, demonstrated for plastic classification in recycling.

Keywords:
integrated photonicsmaterial classificationnear infraredspectral sensing

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Area of Science:

  • Spectroscopy
  • Material Science
  • Remote Sensing

Background:

  • Material composition analysis is crucial for industrial monitoring, recycling, agriculture, and environmental applications.
  • Spectral imaging offers combined spatial and spectral data but faces cost barriers, especially for near-infrared (NIR) applications due to expensive detector arrays.
  • Existing visible multispectral imaging (MSI) solutions are cost-effective due to silicon detector availability.

Purpose of the Study:

  • To develop a cost-effective standoff material sensing system that bridges the gap in NIR spectral imaging.
  • To enable chemical characterization of materials without full spectral imaging hardware.
  • To demonstrate the system's utility in practical applications like plastic classification.

Main Methods:

  • A novel concept combining spatial imaging in the visible spectrum using a CMOS camera with point-based NIR spectral measurements.
  • Utilizing a dedicated NIR spectral sensor for targeted spectral data acquisition.
  • Implementing the system in a standoff configuration for non-contact material analysis.

Main Results:

  • The system successfully performed chemical characterization of materials from a distance.
  • Demonstrated capability in classifying visually identical plastics of different types in a standoff setup.
  • Enabled spectral measurements at up to 100 distinct points within a scene.

Conclusions:

  • The developed system offers a viable alternative to traditional spectral imaging for standoff material sensing.
  • This approach reduces hardware costs associated with NIR spectral imaging.
  • The technology shows significant potential for applications in recycling and industrial process monitoring.