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Updated: Jan 17, 2026

Non-equilibrium Microwave Plasma for Efficient High Temperature Chemistry
Published on: August 1, 2017
The impact of compound addition sequence on functional, antioxidant, and thermal properties of dielectric barrier
Maryam Tamsen1, Nafiseh Soltanizadeh1, Milad Fathi1
1Department of Food Science and Technology, College of Agriculture, Isfahan University of Technology, Isfahan 84156-83111, Iran.
Abstract:
The present study aimed to form a ternary complex using carboxymethyl cellulose (CMC), soy protein isolate (SPI), and curcumin (CUR) through dielectric barrier discharge (DBD) plasma technology and to investigate the effects of this treatment on the functional, antioxidative, and thermal properties of the ternary complex. The antioxidant activity was similar in the mixtures before and after plasma treatment, except for the SPI-CUR and CUR (SPI-CMC) mixtures. Plasma treatment increased carbonyl content in protein-containing mixtures, with the exception of CMC (SPI-CUR). Surface hydrophobicity increased by 233 % and 364 % in SPI-CMC and CMC (SPI-CUR) post-plasma, respectively. The complexes exhibited approximately 250-430 % higher solubility and 10-40 % higher emulsifying activity than SPI, except for SPI-CUR. TGA results indicated higher thermal resistance after the formation of the complex. The SPI (CMC-CUR) complex displayed superior antioxidant activity, foaming capacity, foam stability, emulsifying activity, emulsion stability, and thermal resistance than other ternary complexes.
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