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Production and Testing of Moisture Behavior and Thermal Properties of Rapeseed Straw and Ganoderma resinaceum Mycelium Bio-Composites
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Investigating the Thermal Properties of Structural Partitions Produced Using Additive Technology (3D Printing) from

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Area of Science:

  • Materials Science
  • Sustainable Building Materials
  • Additive Manufacturing

Background:

  • Increasing demand for advanced thermal insulation alternatives to traditional materials.
  • 3D printing offers novel possibilities for creating complex insulation structures from diverse raw materials.
  • Need for enhanced building energy efficiency through innovative insulation solutions.

Purpose of the Study:

  • To develop a 3D printed thermal insulation barrier with performance comparable to conventional materials.
  • To utilize additive manufacturing (3D SLS printing) for fabricating cellular structures from TPS and PA12.
  • To assess the energy efficiency and cost-effectiveness of novel insulation materials in building simulations.

Main Methods:

  • Fabrication of Kelvin cell-based cellular materials using 3D Selective Laser Sintering (SLS) printing.
  • Formulation of a composite material using thermoplastic starch (TPS) and polyamide 12 (PA12).
  • Testing of thermal insulation properties: thermal conductivity, thermal transmittance (U-value), and thermal resistance.

Main Results:

  • A double-layer partition of TPS + PA12 (5:5 ratio, 60 mm thickness) exhibited superior thermal insulation.
  • Achieved thermal conductivity (λ) of 0.026 W/(m·K), thermal resistance (R) of 2.4 (m²·K)/W, and U-value of 0.42 W/(m²·K).
  • Energy simulations indicated potential for enhanced building energy efficiency and cost-effectiveness.

Conclusions:

  • 3D printed cellular TPS/PA12 composites show promise as effective thermal insulation materials.
  • Optimized composite formulations and structures can meet stringent energy efficiency requirements.
  • This approach offers a sustainable and innovative alternative for building insulation applications.