An Acid-Cleavable Lamellar Block Copolymer for Sub-30-nm Line Spacing Patterning via Graphoepitaxial Directed...

Graphoepitaxial directed self-assembly (DSA) of block copolymers (BCPs) has emerged as a promising strategy for sub-30 nm line spacing patterning in semiconductor nanofabrication. Among the available BCP systems, polystyrene-block-poly (methyl methacrylate) (PS-b-PMMA) has been extensively utilized due to its well-characterized phase behavior and compatibility with standard lithographic processes. However, achieving a high-fidelity pattern with PS-b-PMMA remains challenging, owing to its limited etch contrast and reliance on UV-assisted degradation for PMMA removal. In this study, we report the synthesis of an acid-cleavable lamellar BCP, PS-N=CH-PMMA, incorporating a dynamic Schiff base (-N=CH-) linkage at the junction. This functional design enables UV-free wet etching, allowing selective removal of PMMA domains using glacial acetic acid. The synthesized copolymers retain the self-assembly characteristics of PS-b-PMMA and form vertically aligned lamellar nanostructures, with domain spacings tunable from 36.1 to 40.2 nm by varying the PMMA block length. When confined within 193i-defined trench templates with a critical dimension (CD) of 55 nm (trench width), these materials produced well-ordered one-space-per-trench patterns with interline spacings tunable from 15 to 25 nm, demonstrating significant line spacing shrinkage relative to the original template CD. SEM and FIB-TEM analyses confirmed that PS-N=CH-PMMA exhibits markedly improved vertical etch profiles and reduced PMMA residue compared to PS-b-PMMA, even without UV exposure. Furthermore, Ohta-Kawasaki simulations revealed that trench sidewall angle critically influences PS distribution and residual morphology. Collectively, this work demonstrates the potential of dynamic covalent chemistry to enhance the wet development fidelity of BCP lithography and offers a thermally compatible, UV-free strategy for sub-30 nm nanopatterning.