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To be visualized by an electron microscope, either transmission or scanning, biological samples need to be fixed (stabilized) so the electron beam does not destroy them and dried thoroughly (desiccated/dehydrated) so the vacuum does not affect them. Fixation needs to be done as quickly as possible because the sample properties will start changing as soon as it is removed from its natural environment. For example, in a tissue sample, the oxygen levels begin decreasing, causing an altered...
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In-situ microscale cold welding using a focused ion beam-scanning electron microscope.

Ambra Celotto1, Randi Holmestad2, Filippo Berto3

  • 1Department of Mechanical and Industrial Engineering, Norwegian University of Science and Technology, Trondheim 7491, Norway.

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Microscale cold welding successfully joined dissimilar metals like aluminum and copper without surface prep. This method uses plastic deformation and shear forces, offering a promising alternative to heat-assisted joining for electronics.

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Cold weldingElectron microscopyFIB-SEMMicro weldingMicrofabrication

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Area of Science:

  • Materials Science
  • Manufacturing Engineering
  • Surface Science

Background:

  • Microscale cold welding offers efficient, low-temperature joining for electronic components, preserving material properties.
  • Limited understanding of dissimilar metal bonding mechanisms hinders industrial adoption, especially at the microscale.
  • Heat-assisted methods remain prevalent for microscale joining due to these limitations.

Purpose of the Study:

  • To develop and demonstrate a testbed procedure for microscale cold welding of dissimilar metals.
  • To investigate the bonding mechanisms and identify factors influencing joint quality.
  • To evaluate the feasibility of this technique for practical applications.

Main Methods:

  • Utilized a Focused Ion Beam (FIB)-scanning electron microscope for precise control and characterization.
  • Employed a novel method of pushing a tapered copper wire into an aluminum alloy hole.
  • Performed cross-sectional analysis, elemental mapping, and transmission electron microscopy (TEM).

Main Results:

  • Achieved successful bonding of aluminum and copper without prior surface preparation.
  • Observed significant grain refinement and mechanical removal of contaminants via shear forces.
  • Identified FIB residuals as a source of bonding defects; uniform interfaces formed in their absence.
  • Confirmed interdiffusion and formation of a thin Al-Cu intermetallic layer via TEM.

Conclusions:

  • Microscale cold welding is viable for dissimilar metal joining, producing high-quality bonds through plastic deformation and shear.
  • Surface contaminants and FIB residuals are critical factors affecting bond integrity.
  • The developed technique shows potential for industrial applications in microelectronics and beyond.