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Supramolecular Interface Engineering via Interdiffusion for Reusable and Dismantlable Polymer Adhesion.

Kenji Yamaoka^1,2, Takuma Wada¹, Iori Ogasa¹

¹Department of Macromolecular Science, Graduate School of Science, The University of Osaka, Toyonaka, Osaka, 560-0043, Japan.

Advanced Materials (Deerfield Beach, Fla.)

|October 3, 2025

Summary

This summary is machine-generated.

This study presents a novel polymeric adhesion system using reversible supramolecular complexes, enabling controllable adhesion for sustainable materials. The system allows for easy reuse and dismantling via thermal or chemical stimuli.

Keywords:

dismantlable interdiffusion neutron reflectivity polymer adhesion reusable reversible bond

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Area of Science:

Materials Science
Polymer Chemistry
Supramolecular Chemistry

Background:

Controllable adhesion is crucial for sustainable materials and device integration, requiring both reusability and dismantlability.
Existing adhesion systems often lack mechanisms for controlled association and dissociation.

Purpose of the Study:

To develop a polymeric adhesion system with externally regulated reversible interactions.
To optimize adhesion properties by tuning polymer glass transition temperature (Tg) for enhanced interdiffusion and bond recombination.

Main Methods:

Utilized supramolecular complexes with thermal and chemical stimuli-responsive behavior.
Investigated the effect of glass transition temperature (Tg) on polymer chain mobility and complex reformation.
Employed Neutron Reflectivity (NR) measurements with deuterium labeling to analyze interfacial properties.

Main Results:

Demonstrated tunable adhesion strength and controlled interdiffusion by adjusting polymer Tg.
Observed increased interfacial width with annealing temperature, reaching 24.4 nm at 200°C.
Found that reversible bonds enhanced adhesion strength while suppressing excessive polymer interdiffusion.

Conclusions:

The developed polymeric adhesion system offers controllable reuse and dismantling under mild stimuli.
Shows significant potential for applications in recyclable electronics, automotive manufacturing, and temporary assembly.