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A full-featured 2D flash chip enabled by system integration.

Chunsen Liu1, Yongbo Jiang2, Boqian Shen2

  • 1State Key Laboratory of Integrated Chips and Systems, College of Integrated Circuits and Micro-Nano Electronics, Frontier Institute of Chip and System, Zhangjiang Fudan International Innovation Center, Fudan University, Shanghai, China. chunsen_liu@fudan.edu.cn.

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Researchers developed a full-featured two-dimensional (2D) NOR flash memory chip using atomic device to chip (ATOM2CHIP) technology. This innovation integrates 2D electronics with CMOS for advanced system-level applications.

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Nanotechnology

Background:

  • Two-dimensional (2D) materials offer advanced device scalability and novel electronic mechanisms, extending beyond traditional silicon (Si) technology.
  • Significant research efforts in academia and industry focus on integrating 2D materials for advanced integrated circuits.
  • Existing integration methods for 2D materials and 2D-CMOS hybrids have not yet fully translated device advantages to system-level applications.

Purpose of the Study:

  • To demonstrate a complete two-dimensional (2D) NOR flash memory chip by integrating advanced 2D electronic devices with a complementary metal-oxide-semiconductor (CMOS) platform.
  • To present the atomic device to chip (ATOM2CHIP) technology as a framework for bridging the gap between emerging 2D device concepts and practical chip applications.
  • To showcase a novel system integration strategy that effectively leverages the benefits of 2D electronic systems.

Main Methods:

  • Developed a full-stack on-chip process integrating planar and three-dimensional (3D) architectures with chip packaging for high-yield manufacturing.
  • Implemented a cross-platform system design enabling compatibility between 2D circuit design and 2D-CMOS modules.
  • Designed a complex, instruction-driven chip featuring 8-bit commands and 32-bit parallelism for comprehensive functionality.

Main Results:

  • Successfully realized a full-featured 2D NOR flash memory chip using the ATOM2CHIP technology.
  • Achieved a high manufacturing yield of 94.34% through the integrated full-stack on-chip process.
  • Demonstrated a highly complex, instruction-driven chip capable of 32-bit parallelism, validating the system integration strategy.

Conclusions:

  • The ATOM2CHIP technology provides a complete framework for developing applicable chips from emerging 2D device concepts.
  • The developed 2D NOR flash memory chip showcases the potential of 2D electronics for advanced system-level applications.
  • This work highlights an efficient system integration strategy that effectively translates the advantages of 2D electronic devices into practical chip performance.