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Low-Cost Maskless Photolithography Using an LCD-3D Printer for Microelectronic Devices
Qianqian Wu1,2, Ying Zhang2,3, Thomas Pucher2,3
1Engineering Research Center of IoT Technology Applications (Ministry of Education), School of Integrated Circuits, Jiangnan University, Wuxi, 214122, China.
Small Methods
|October 11, 2025
Summary
This study introduces a low-cost maskless photolithography technique using a 3D printer for rapid microdevice fabrication. The method achieves high-resolution patterning, creating quality field-effect transistors and photodetectors comparable to traditional methods.
Area of Science:
- Materials Science
- Microfabrication
- Nanotechnology
Background:
- Traditional photolithography relies on costly photomasks, limiting accessibility for microdevice fabrication.
- Masked Stereolithography Apparatus (MSLA) 3D printers offer potential for cost-effective patterning but require adaptation for microfabrication.
Purpose of the Study:
- To present a maskless photolithography method using a commercial LCD-based MSLA 3D printer.
- To demonstrate rapid and flexible patterning of silicon wafers for microdevice fabrication.
- To fabricate large-area wafer-scale electrode arrays and integrate two-dimensional (2D) materials.
Main Methods:
- Utilized a commercial LCD-based MSLA 3D printer for maskless photolithography.
- Patterned photoresist-coated silicon wafers without traditional photomasks.
- Fabricated gold electrodes for 2D material-based transistors and integrated MoS2 flakes using an all-dry deterministic transfer method.
Main Results:
- Achieved spatial resolution approaching 20 µm.
- Successfully fabricated field-effect transistors and photodetectors using MoS2.
- Demonstrated comparable device quality to conventional photolithography.
Conclusions:
- LCD-based MSLA 3D printing provides a cost-effective and flexible alternative for maskless photolithography.
- This approach enables high-precision microfabrication and the creation of advanced electronic devices.
- The method is highly accessible for researchers and industries requiring low-cost microdevice fabrication solutions.

