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Dynamic beam-stabilized, additive-printed flexible antenna arrays with on-chip rapid insight generation
Sreeni Poolakkal1, Abdullah Islam2, Arpit Rao3
1School of Electrical Engineering and Computer Science, Washington State University, Pullman, WA, USA. sreeni.poolakkal@wsu.edu.
Nature Communications
|October 14, 2025
Summary
This study presents a novel dynamic beam-stabilized processor for conformal phased arrays, overcoming deformation-induced errors. It enables real-time beam adaptation using low-cost, stable copper inks for reliable on-the-move communication.
Area of Science:
- Engineering
- Materials Science
- Computer Science
Background:
- Conformal phased arrays offer shape-changing capabilities for diverse platforms but face challenges with dynamic deformation and material limitations.
- Existing conformal arrays struggle with beam pointing errors caused by physical deformation during operation.
- Conventional printable inks for conformal arrays are costly (silver) or unstable (copper), impacting performance.
Purpose of the Study:
- To introduce a dynamic beam-stabilized processor for real-time correction of deformation-induced beam pointing errors in conformal phased arrays.
- To develop and utilize a novel, low-cost, and stable copper-based printable ink for enhanced conformal array fabrication.
- To demonstrate a unified approach for correcting both material and physical deformations in conformal phased arrays for improved performance.
Main Methods:
- Development of a silicon-integrated dynamic beam-stabilized processor with on-chip real-time control of gain, phase, and delay for each array element.
- Utilization of a low-cost copper molecular decomposition ink with minimal variation across temperature and strain (<0.1% per °C).
- Integration of the processor with the novel ink to correct residual deformities in real-time, achieving unified material and physical deformation correction.
Main Results:
- The dynamic beam-stabilized processor effectively corrects beam pointing errors caused by dynamic deformations in conformal phased arrays.
- The novel copper ink demonstrates superior stability and low cost compared to traditional silver or copper inks, maintaining trace impedance.
- The integrated system achieves real-time, unified correction of material and physical deformations, enabling robust beamforming.
Conclusions:
- The developed silicon-integrated dynamic beam-stabilized processor offers a low-power, low-area, and scalable solution for conformal phased arrays.
- This technology significantly enhances the reliability and performance of conformal arrays for on-the-move communication and sensing applications.
- The unified approach to material and physical deformation correction paves the way for practical, on-device implementations of advanced phased array systems.

