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DIC-Aided Mechanoluminescent Film Sensor for Quantitative Measurement of Full-Field Strain
Guoqing Gu1, Liya Dai1, Liyun Chen2,3
1School of Civil Engineering, Yancheng Institute of Technology, Yancheng 224051, China.
Sensors (Basel, Switzerland)
|October 16, 2025
Summary
This study introduces a novel method for measuring strain fields by fusing mechanoluminescent (ML) imaging with digital image correlation (DIC). This technique accurately quantifies strain distributions, advancing material analysis.
Area of Science:
- Materials Science
- Mechanical Engineering
- Optical Measurement
Background:
- Mapping mechanoluminescent (ML) intensity to strain fields presents a significant challenge.
- Accurate full-field strain measurement is crucial for understanding material behavior under load.
Purpose of the Study:
- To develop a quantification method for full-field strain measurement by integrating ML imaging and digital image correlation (DIC).
- To establish a quantitative calibration model between ML intensity and strain for precise reconstruction of strain fields.
Main Methods:
- Simultaneous acquisition of ML images from ML film sensors and speckle images for DIC during tensile tests on aluminum alloy specimens.
- Application of spatial registration and region matching algorithms to develop a quantitative calibration model.
- Validation using aluminum alloy notched specimens.
Main Results:
- A significant linear correlation (R² = 0.92) was established between ML intensity and DIC-measured strain.
- The reconstructed strain field showed excellent agreement with DIC and finite element analysis (FEA) results, with a low average relative error of 0.23%.
Conclusions:
- The proposed method enables non-contact, full-field strain measurement with high spatial resolution by converting ML signals into strain distributions.
- This provides a quantitative foundation for investigating ML response mechanisms under complex loading conditions.
