DIC-Aided Mechanoluminescent Film Sensor for Quantitative Measurement of Full-Field Strain

To break through the bottleneck in the mapping of the mechanoluminescent (ML) intensity field to the strain field, a quantification method for full-field strain measurement based on pixel-level data fusion is proposed, integrating ML imaging with digital image correlation (DIC) to achieve precise reconstruction of the strain field. Experiments are conducted using aluminum alloy specimens coated with ML film sensor on their surfaces. During the tensile process, ML images of the films and speckle images of the specimen backsides are simultaneously acquired. Combined with DIC technology, high-precision full-field strain distributions are obtained. Through spatial registration and region matching algorithms, a quantitative calibration model between ML intensity and DIC strain is established. The research results indicate that the ML intensity and DIC strain exhibit a significant linear correlation (R² = 0.92). To verify the universality of the model, aluminum alloy notched specimen tests show that the reconstructed strain field is in good agreement with the DIC and finite element analysis results, with an average relative error of 0.23%. This method enables full-field, non-contact conversion of ML signals into strain distributions with high spatial resolution, providing a quantitative basis for studying ML response mechanisms under complex loading.