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Published on: July 5, 2024
Simulation Analysis of Temperature Change in FDM Process Based on ANSYS APDL and Birth-Death Element Technology
Yuehua Mi1,2,3, Seyed Hamed Hashemi Sohi1
1School of Mechanical Manufacturing and Energy Engineering, School of Graduate Studies, Mapúa University, Manila 1002, Philippines.
This study uses finite element simulation to analyze temperature changes in Fused Deposition Modeling (FDM). The research accurately predicts thermal behavior and stress, improving FDM printing quality and reducing warpage.
Area of Science:
- Additive Manufacturing
- Materials Science
- Computational Mechanics
Background:
- Temperature changes in Fused Deposition Modeling (FDM) are nonlinear and critical for printing efficiency, accuracy, and warpage.
- Understanding thermal evolution and thermomechanical behavior is essential for optimizing the FDM process.
Purpose of the Study:
- To develop and present a finite element simulation framework for analyzing temperature evolution and thermomechanical behavior during FDM.
- To investigate the dynamic simulation of the complete printing and cooling cycle in FDM.
Main Methods:
- Integration of ANSYS Parametric Design Language (APDL) with birth-death element technology for finite element simulation.
- Dynamic simulation of layer-by-layer material deposition and subsequent thermal history.
- Thermomechanical coupling analysis to evaluate stress and strain distribution.
Main Results:
- Temperature distribution exhibits a gradient along the printing path, with peripheral heat dissipation and central heat accumulation.
- Significant stress concentration (310 MPa) observed at the part bottom.
- Progressive strain increase from bottom (3.68 × 10-5 m) to top (2.95 × 10-4 m).
Conclusions:
- The integrated simulation framework effectively predicts thermal-induced deformations in FDM.
- Numerical predictions show strong agreement with experimental validation (temperature deviations < 8%, strain errors < 5%).
- The approach provides a valuable tool for optimizing FDM process parameters to enhance part quality and minimize warpage.
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