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Recent Advances in Precision Diamond Wheel Dicing Technology.

Fengjun Chen1, Meiling Du1,2, Ming Feng2

  • 1School of Robot Engineering, Wenzhou University of Technology, Wenzhou 325000, China.

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|October 29, 2025
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Summary
This summary is machine-generated.

Precision diamond wheel dicing enhances semiconductor and aerospace manufacturing. This review details dicing technologies, blade preparation, and process controls for improved machining of hard-and-brittle materials.

Keywords:
control algorithmsdiamond bladedicing processprocess parameterstool wear

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Area of Science:

  • Materials Science and Engineering
  • Manufacturing Technology

Background:

  • Precision dicing with diamond wheels is crucial for semiconductor, integrated circuit, and aerospace industries.
  • Machining quality of hard-and-brittle optoelectronic materials requires comprehensive analysis of dicing technologies.

Purpose of the Study:

  • To review core principles of precision diamond wheel dicing.
  • To analyze dicing processes, blade preparation, and control systems for improved machining quality.

Main Methods:

  • Examination of composite and multi-mode dicing mechanisms.
  • Review of dicing blade preparation methods (e.g., metal binder sintering, roll forming).
  • Analysis of machine vision, servo control systems, and key grinding wheel dicer components.

Main Results:

  • Composite and multi-mode dicing reduce defects compared to single-mode approaches.
  • Advanced algorithms in machine vision and servo control enhance precision.
  • Analysis of process parameters (spindle speed, feed rate, dicing depth) impacts dicing quality and kerf width.

Conclusions:

  • Precision diamond wheel dicing is vital for advanced manufacturing.
  • Understanding dicing mechanisms, blade preparation, and process controls is key to improving machining quality.
  • Future research should focus on advancing key technologies in precision dicing.