Formulation Strategies for High-Thermal-Conductivity Organosilicon Potting Adhesive

In this study, we present a novel high-thermal-conductivity-organosilicon potting adhesive developed for use in power modules. The adhesive is designed to enhance power modules' thermal properties and mechanical strength, addressing the need for more efficient and reliable encapsulation materials in electronic applications. By optimizing the resin formulation, the adhesive exhibits improved tensile strength and elongation at break properties, making it particularly suitable for applications requiring high durability and resilience under thermal and mechanical stress. Herein, we propose a high-thermal-conductivity organosilicon electronic potting adhesive designed for power modules. The adhesive consists of two components: Component A and Component B. Component A is composed of a base polymer (0.5-10 parts), silicone resin (0.15-10 parts), plasticizer (0.5-5 parts), color paste (0.01-0.2 parts), thermally conductive filler (70-120 parts), filler treatment agent (2-8 parts), and a catalyst (0.1-2 parts). Component B includes a base polymer (0.5-10 parts), silicone resin (0.15-10 parts), plasticizer (0.5-5 parts), thermally conductive filler (70-120 parts), crosslinking agent (0.1-10 parts), chain extender (0.1-10 parts), and crosslinking inhibitor (0.01-1 part). The adhesive is designed to improve the tensile strength and elongation at break. These materials were engineered to facilitate easy repair and disassembly, ensuring cost-effective maintenance and reuse in power module systems. This work demonstrates the potential of the adhesive in advancing the performance and longevity of power electronics, providing valuable insights into its practical application for high-performance electronic devices.