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Three-Dimensional Interconnect Technologies for Advanced Flexible Electronics.

Jun Zhao1,2, Haokun Yi1,2, Mengfei Xu1,2

  • 1Department of Materials Science, Fudan University, Shanghai, 200433, P. R. China.

Advanced Materials (Deerfield Beach, Fla.)
|November 3, 2025
PubMed
Summary
This summary is machine-generated.

Three-dimensional (3D) flexible electronics offer enhanced performance and miniaturization through vertical integration. This review explores advancements in 3D flexible interconnects, addressing challenges in materials, fabrication, and signal integrity for next-generation devices.

Keywords:
3D integrationflexible electronicsinterconnects

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Electronics Engineering

Background:

  • Conventional 2D flexible electronics face limitations in integration density and performance.
  • Three-dimensional (3D) integration offers a solution for miniaturization and improved signal integrity in flexible systems.
  • Developing reliable 3D interconnects for flexible electronics presents challenges in materials, fabrication, and signal management.

Purpose of the Study:

  • To systematically review recent advancements in 3D flexible interconnects.
  • To examine material innovations, fabrication techniques, and integration strategies for 3D flexible electronics.
  • To highlight applications and discuss future research directions in 3D flexible electronics.

Main Methods:

  • Review of recent literature on 3D flexible interconnects.
  • Analysis of material innovations, fabrication processes, and integration strategies.
  • Examination of crosstalk suppression techniques and application examples.

Main Results:

  • Progress has been made in developing stretchable and conductive materials for 3D interconnects.
  • Robust fabrication processes for multilayer integration are emerging.
  • Strategies for mitigating interfacial stress and signal crosstalk are being developed.

Conclusions:

  • 3D integration is a transformative approach for flexible electronics, overcoming limitations of 2D architectures.
  • Addressing challenges in interconnect reliability is crucial for realizing the full potential of 3D flexible systems.
  • Continued research in materials, fabrication, and design will drive the advancement of 3D flexible electronics.