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3D Printing High-Performance Piezoelectric Ceramic with Complex Structure for Ultrasonic Array Transducer.
Kun Zheng1, Yi Quan2, Weigang Ma3
1State Key Laboratory for Manufacturing Systems Engineering, School of Instrument Science and Technology, Xi'an Jiaotong University, Xi'an, 710049, China.
High-performance 3D-printed piezoelectric ceramics achieve a record piezoelectric coefficient (d33) of 1285 pC N-1. This breakthrough enables advanced ultrasonic transducers with enhanced imaging capabilities.
Area of Science:
- Materials Science
- Additive Manufacturing
- Piezoelectric Ceramics
Background:
- 3D printing offers advantages in fabricating piezoelectric ceramics but faces limitations in microstructure, densification, and electrical properties.
- Existing methods struggle with complex geometries and achieving high performance for practical device applications.
Purpose of the Study:
- To develop a 3D printing method for high-performance piezoelectric ceramics with complex geometries.
- To demonstrate the fabrication of advanced devices, specifically ultrasonic transducers, using this method.
Main Methods:
- Utilized the digital light processing (DLP) technique for 3D printing.
- Manufactured samarium-doped lead magnesium niobate-lead titanate (Sm-PMN-PT) piezoelectric ceramics.
- Designed and fabricated an ultrasonic transducer annular array.
Main Results:
- Achieved a piezoelectric coefficient (d33) of 1285 pC N-1, the highest reported for 3D-printed piezoelectric ceramics.
- Fabricated an ultrasonic transducer with a 60% bandwidth, 952 mV peak-to-peak voltage, and improved imaging resolution.
- Demonstrated a new benchmark for 3D-printed ultrasonic transducer performance.
Conclusions:
- 3D printing, specifically DLP, can produce high-performance piezoelectric ceramics with complex structures.
- The developed method enables the creation of advanced devices like ultrasonic transducers, overcoming limitations of traditional manufacturing.
- This work highlights the significant potential of 3D-printed piezoelectric ceramics for demanding device applications.
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