Advanced Epoxy Resin/Boron Nitride Composites for High-Performance Electrotechnical Applications and Geological...

Composites were obtained by using a commercial bicomponent epoxy resin (containing Al₂O₃ and SiO₂) and cubic BN (cBN) (0-50 wt.%). Two preparation methods were used: (a) the cBN powder was first mixed with the resin base and further with the hardener, and (b) the cBN powder was first mixed with hardener and afterwards with the resin base. Both methods show a similar enhancement trend in the thermal conductivity from 0.77 W/mK in the resin without additive to 1 and 1.5 W/mK in the ones filled with 30 and 50 wt.% cBN, respectively. A reasonable decrease in bending strength from 74 for 0 wt.% cBN to 70 or 64 MPa for 30 wt.% cBN added by method (a) or (b), respectively, occurs. The bending strain at breakage decreased from 5.58% to 2.65 or 3.78%. High sensitivity vs. processing was also found for electrical properties measured for frequencies of 1-10⁷ Hz. An increasing amount of cBN decreased the room temperature conductivity, dielectric constant, and dielectric loss tangent and modified the shape of the curves vs. frequency. However, in samples with 30 wt.% or more of cBN, a partial recovery to a high insulating state was observed.