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Published on: December 23, 2013
Manufacturing and Application of Low-Cost Potting Adhesive with High Thermal Conductivity
Junxiang Wang1, Shiwei Zhang1, Caiman Yan1
1Intelligent Manufacturing Engineering Laboratory of Functional Structure and Device in Guangdong, School of Mechanical and Automotive Engineering, South China University of Technology, Guangzhou 510640, China.
Abstract:
The air-cored linear synchronous motor (ACLSM), characterized by high precision and stability, is widely applied in high-precision manufacturing. However, due to the absence of an iron core, the windings must be fixed with low thermal conductivity epoxy-based potting adhesive, leading to poor heat dissipation and significant temperature rise, which risks the motor's lifespan and accuracy. To improve heat dissipation in ACLSM, this research proposes a multi-scale filler-based strategy to enhance the thermal conductivity of the adhesive. A series of comprehensive characterizations and thermal tests demonstrates the effectiveness of this approach. The results demonstrate that the BN-AlN sample exhibits superior thermal conductivity of 1.182 W/m·K at 25 wt% filler loading, a 48.7% enhancement over commercially adhesive 381-4DZ, with only a 38% increase in cost. Meanwhile, it possesses superior electrical insulation properties and appropriate hardness, making it highly suitable for the potting of ACLSM windings. The winding encapsulating with the modified adhesive achieves a maximum temperature reduction of 8.82 °C, while improving temperature uniformity by 29.8%, confirming its exceptional thermal management capability.

