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Bridging the Bio-Electronic Interface with Biofabrication
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Metal-hydrogel chelation interfaces for ultrasoft and bidirectional bioelectronics.

Yuyao Lu1, Ziguan Jin1, Yihui Jian1

  • 1State Key Laboratory of Fluid Power and Mechatronic Systems, School of Mechanical Engineering, Zhejiang University, Hangzhou 310027, China.

National Science Review
|November 17, 2025
PubMed
Summary
This summary is machine-generated.

Researchers developed a new hydrogel-metal interface for soft bioelectronic systems, improving stiffness control and electrical connections for better signal recording from skin and brain.

Keywords:
bioelectronicschelationhybrid interfacial bondinghydrogelmetal

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Area of Science:

  • Bioelectronic Systems
  • Materials Science
  • Biomedical Engineering

Background:

  • Soft bioelectronic systems face challenges in integrating components with different stiffness moduli.
  • Achieving stable and reliable electrical interfaces between soft biological tissues and electronic circuits is crucial.

Purpose of the Study:

  • To develop a robust and mechanically compliant interface between hydrogels and metal electrodes for soft bioelectronics.
  • To enhance the integration of soft biological tissues with electronic data acquisition systems.

Main Methods:

  • Utilized dual-mode chelation (internal and surface) to control hydrogel cross-linking and metal-hydrogel binding.
  • Engineered hydrogel with an ultra-low modulus (∼339.9 Pa) for tissue-like softness.
  • Promoted interlocked structures between metal oxide nanoislands for strong interfacial binding (∼1.95 MPa).

Main Results:

  • Achieved a tissue-like soft hydrogel with significantly reduced modulus.
  • Established a high binding strength between metal electrodes and hydrogel without compromising conductivity.
  • Demonstrated stable, high signal-to-noise ratio recordings from skin, neural surfaces, and brain, even under mechanical stress.

Conclusions:

  • The developed hybrid interfacial bonding strategy provides mechanically and electrically robust bioelectronic interfaces.
  • This approach advances the application of soft bioelectronics in capturing both in vitro and in vivo electrical signals.
  • Offers a promising solution for bridging the stiffness and connectivity gap in soft bioelectronic systems.