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Dry Transfer of CVD Graphene Film Using Adhesion Switchable Ferroelectric Polymers.

Deqiang Zhang1,2, Jing Ying Yeo1, Hanning Zhang3

  • 1Department of Physics, National University of Singapore, Singapore, 117551, Singapore.

Advanced Materials (Deerfield Beach, Fla.)
|November 19, 2025
PubMed
Summary

A novel dry transfer method uses a ferroelectric polymer film to enable large-scale, residue-free transfer of high-quality graphene and other 2D materials. This industrially compatible process overcomes limitations of wet transfers for scalable manufacturing.

Keywords:
2D materialsCVD grapheneautomated transferdry transferferroelectric polymersinterfacial adhesiontunable adhesion

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Area of Science:

  • Materials Science
  • Nanotechnology
  • Surface Science

Background:

  • Chemical vapor deposition (CVD) enables large-scale, high-quality graphene (Gr) synthesis on copper (Cu) foils.
  • Existing transfer methods (wet and dry) face challenges like chemical waste, scalability, mechanical damage, and residues due to strong Gr-Cu adhesion.

Purpose of the Study:

  • To develop a fully dry, industrially compatible transfer platform for graphene and other 2D materials.
  • To overcome the limitations of conventional transfer methods for scalable integration of 2D materials.

Main Methods:

  • Utilized a ferroelectric poly(vinylidene-fluoride-trifluoroethylene) (P(VDF-TrFE)) film as a support and transfer layer with electrostatically switchable adhesion.
  • Employed negative Corona poling to induce p-type doping in graphene, reducing Gr-Cu adhesion and enhancing P(VDF-TrFE)-Gr adhesion.
  • Used thermal annealing above the Curie temperature (≈135 °C) to depolarize the P(VDF-TrFE) film for clean material release.

Main Results:

  • Achieved clean, large-scale graphene delamination from Cu foils with >99% coverage.
  • Demonstrated the transfer of other 2D materials, including molybdenum disulfide and hexagonal boron nitride.
  • Validated the process on cm-scale samples using an automated system with a transfer time of <5 minutes.

Conclusions:

  • The developed dry transfer platform offers a viable, scalable solution for industrial production of high-quality 2D material films.
  • The electrostatically switchable adhesion of P(VDF-TrFE) effectively addresses challenges in 2D material transfer.
  • This method paves the way for broader integration of advanced 2D materials in various applications.