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Multi-layer encapsulation structures for stable bottom- and top-emitting white OLED devices.

Ping-An Chen1, Zian Yu1, Hengjun Chen1

  • 1School of Electrical Engineering, University of South China Hengyang 421001 China liuchang2046@163.com lxj505873@163.com.

RSC Advances
|November 20, 2025
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This study developed advanced encapsulation for white Organic Light-Emitting Diodes (OLEDs), significantly improving device stability and longevity against environmental and thermal degradation. The novel multi-layer protection enhances performance for both top- and bottom-emitting OLED applications.

Area of Science:

  • Materials Science
  • Optoelectronics
  • Device Engineering

Background:

  • Organic Light-Emitting Diodes (OLEDs) suffer from poor environmental stability, thermal tolerance, and material decomposition.
  • Existing encapsulation methods often fail to provide comprehensive protection against these degradation factors.

Purpose of the Study:

  • To develop and evaluate a novel multi-layer encapsulation structure for white OLED devices.
  • To enhance the environmental stability, thermal tolerance, and operational lifetime of both top- and bottom-emitting OLEDs.
  • To maintain high light transmittance through the encapsulation layers.

Main Methods:

  • Fabrication of white OLEDs using stacked tricolor luminescent materials.
  • Construction of a multi-layer encapsulation system including heat-conductive films, inorganic barrier layers, transparent glues, POSS resin, and transparent films/glasses.

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  • Implementation of a three-dimensional protection strategy involving environmental isolation, stress buffering, and thermal management.
  • Characterization of device performance, including external quantum efficiency (EQE) and light decay over time under accelerated testing.
  • Main Results:

    • Encapsulated top-emitting OLEDs achieved an EQE of 11.6%, and bottom-emitting OLEDs achieved 7.5%.
    • The designed encapsulation significantly reduced light decay compared to unencapsulated devices.
    • After 720 hours, encapsulated devices showed only 16-20% decay, while unencapsulated devices exceeded 40% decay.

    Conclusions:

    • The developed multi-layer encapsulation effectively addresses the stability issues of white OLED devices.
    • The three-dimensional protection system enhances device longevity and reliability under operational stress.
    • This encapsulation strategy is crucial for advancing the commercial viability of high-performance white OLEDs.