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Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging.

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Intense pulsed light (IPL) soldering offers a promising alternative for joining copper pillar bumps on glass substrates. This advanced technique demonstrates improved joint reliability and electrical performance compared to traditional reflow soldering.

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Area of Science:

  • Materials Science
  • Electrical Engineering
  • Semiconductor Manufacturing

Background:

  • Growing demand for miniaturized electronics necessitates advanced soldering for sensitive substrates like glass.
  • Conventional reflow soldering faces limitations with thermally sensitive materials and fine-pitch interconnections.
  • Intense pulsed light (IPL) soldering offers rapid, localized heating with a low thermal budget.

Purpose of the Study:

  • To investigate the application of IPL soldering for Sn-2.5Ag solder-capped copper pillar bump joints on glass substrates.
  • To compare the electrical performance and microstructural characteristics of IPL soldering with conventional reflow soldering.
  • To evaluate the reliability and suitability of IPL soldering for advanced semiconductor packaging.

Main Methods:

  • Preparation of silicon dies with 30 μm diameter, 50 μm pitch copper pillar bumps.
  • Utilized glass substrates with Kelvin structures for precise interconnection resistance measurements.
  • Employed Scanning Electron Microscopy (SEM) and Focused Ion Beam (FIB) for microstructural analysis.

Main Results:

  • IPL soldering produced thinner intermetallic compound layers compared to reflow soldering, enhancing joint reliability.
  • Interconnection resistance decreased with increasing IPL irradiation counts, stabilizing at 50-60 irradiations.
  • IPL soldering demonstrated superior metallurgical and electrical performance over conventional reflow methods.

Conclusions:

  • IPL soldering is a viable and promising technology for attaching copper pillar bumps to glass substrates.
  • The method offers reduced energy consumption, lower thermal stress, and improved joint integrity.
  • IPL soldering is poised to become a next-generation bonding technology for advanced semiconductor packaging.