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Ultrafast Semiconductor Chip Bonding Using Intense Pulsed Light Soldering for Chip-on-Glass Packaging
Taejoon Noh1, Eun-Chae Noh2, Minjae Sung3
1School of Advanced Materials Science & Engineering, Sungkyunkwan University, 2066 Seobu-ro, Jangan-gu, Suwon, Gyeonggi-do 16419, Republic of Korea.
ACS Omega
|November 24, 2025
Summary
Intense pulsed light (IPL) soldering offers a promising alternative for joining copper pillar bumps on glass substrates. This advanced technique demonstrates improved joint reliability and electrical performance compared to traditional reflow soldering.
Area of Science:
- Materials Science
- Electrical Engineering
- Semiconductor Manufacturing
Background:
- Growing demand for miniaturized electronics necessitates advanced soldering for sensitive substrates like glass.
- Conventional reflow soldering faces limitations with thermally sensitive materials and fine-pitch interconnections.
- Intense pulsed light (IPL) soldering offers rapid, localized heating with a low thermal budget.
Purpose of the Study:
- To investigate the application of IPL soldering for Sn-2.5Ag solder-capped copper pillar bump joints on glass substrates.
- To compare the electrical performance and microstructural characteristics of IPL soldering with conventional reflow soldering.
- To evaluate the reliability and suitability of IPL soldering for advanced semiconductor packaging.
Main Methods:
- Preparation of silicon dies with 30 μm diameter, 50 μm pitch copper pillar bumps.
- Utilized glass substrates with Kelvin structures for precise interconnection resistance measurements.
- Employed Scanning Electron Microscopy (SEM) and Focused Ion Beam (FIB) for microstructural analysis.
Main Results:
- IPL soldering produced thinner intermetallic compound layers compared to reflow soldering, enhancing joint reliability.
- Interconnection resistance decreased with increasing IPL irradiation counts, stabilizing at 50-60 irradiations.
- IPL soldering demonstrated superior metallurgical and electrical performance over conventional reflow methods.
Conclusions:
- IPL soldering is a viable and promising technology for attaching copper pillar bumps to glass substrates.
- The method offers reduced energy consumption, lower thermal stress, and improved joint integrity.
- IPL soldering is poised to become a next-generation bonding technology for advanced semiconductor packaging.
